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Sealing of MEMS Atomic Vapor Cells Using Cu-Cu Thermocompression Bonding
Author
Karlen, S.
;
Haesler, J.
;
Overstolz, T.
;
Bergonzi, G.
;
Lecomte, S.
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Publication Reference
Journal of Microelectromechanical Systems, vol. 29 (1), pp. 95-99, Feb 2020.
Year
2020-02
URI
https://yoda.csem.ch/handle/20.500.12839/410
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