Sealing of MEMS Atomic Vapor Cells Using Cu-Cu Thermocompression Bonding

Author

Karlen, S.; Haesler, J.; Overstolz, T.; Bergonzi, G.; Lecomte, S.

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Publication Reference

Journal of Microelectromechanical Systems, vol. 29 (1), pp. 95-99, Feb 2020.

Year

2020-02

URI

https://yoda.csem.ch/handle/20.500.12839/410

Collections

Research Publications