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    Sealing of MEMS Atomic Vapor Cells Using Cu-Cu Thermocompression Bonding

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    Author
    Karlen, S.; Haesler, J.; Overstolz, T.; Bergonzi, G.; Lecomte, S.
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    Publication Reference
    Journal of Microelectromechanical Systems, vol. 29 (1), pp. 95-99, Feb 2020.
    Year
    2020-02
    URI
    https://yoda.csem.ch/handle/20.500.12839/410
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