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dc.contributor.authorKarlen, S.
dc.contributor.authorHaesler, J.
dc.contributor.authorOverstolz, T.
dc.contributor.authorBergonzi, G.
dc.contributor.authorLecomte, S.
dc.date.accessioned2021-12-13T16:35:46Z
dc.date.available2021-12-13T16:35:46Z
dc.date.issued2020-02
dc.identifier.citationJournal of Microelectromechanical Systems, vol. 29 (1), pp. 95-99, Feb 2020.
dc.identifier.urihttps://yoda.csem.ch/handle/20.500.12839/410
dc.titleSealing of MEMS Atomic Vapor Cells Using Cu-Cu Thermocompression Bonding
dc.typeJournal Article
dc.type.csemdivisionsDiv-E
dc.type.csemresearchareasMEMS & Packaging
dc.type.csemresearchareasPhotonics
dc.identifier.doi10.1109/JMEMS.2019.2949349


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