Cu-Cu thermocompression bonding as an innovative sealing method for MEMS atomic vapor cells

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Author
Karlen, Sylvain; Haesler, Jacques; Overstolz, Thomas; Bergonzi, Giovanni; Lecomte, Steve
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Publication Reference
ESA Workshop on Microwave Technology and Techniques (MTT), Noordwijk (NL)
Year
2017
URI
https://yoda.csem.ch/handle/20.500.12839/667
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