Cu-Cu thermocompression bonding as an innovative sealing method for MEMS atomic vapor cells

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Author
Karlen, Sylvain
Haesler, Jacques
Overstolz, Thomas
Bergonzi, Giovanni
Lecomte, Steve
Abstract
Publication Reference
ESA Workshop on Microwave Technology and Techniques (MTT), Noordwijk (NL)
Year
2017
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