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dc.contributor.authorKarlen, Sylvain
dc.contributor.authorHaesler, Jacques
dc.contributor.authorOverstolz, Thomas
dc.contributor.authorBergonzi, Giovanni
dc.contributor.authorLecomte, Steve
dc.date.accessioned2022-02-14T17:07:47Z
dc.date.available2022-02-14T17:07:47Z
dc.date.issued2017
dc.identifier.citationESA Workshop on Microwave Technology and Techniques (MTT), Noordwijk (NL)
dc.identifier.urihttps://yoda.csem.ch/handle/20.500.12839/667
dc.titleCu-Cu thermocompression bonding as an innovative sealing method for MEMS atomic vapor cells
dc.typeConference / Workshop
dc.type.csemdivisionsDiv-E
dc.type.csemresearchareasScientific Instrumentation


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