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dc.contributor.authorKarlen, Sylvain
dc.contributor.authorHaesler, Jacques
dc.contributor.authorOverstolz, Thomas
dc.contributor.authorBergonzi, Giovanni
dc.contributor.authorLecomte, Steve
dc.identifier.citationESA Workshop on Microwave Technology and Techniques (MTT), Noordwijk (NL)
dc.titleCu-Cu thermocompression bonding as an innovative sealing method for MEMS atomic vapor cells
dc.typeConference / Workshop
dc.type.csemresearchareasScientific Instrumentation

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