Abstract
In order to improve the assembly process of microcomponents, three high precision mechanisms were developed. All of them were designed and fabricated at CSEM, through a silicon etching process (DRIE). The devices are an X-Y stage, a micro-gripper and a force sensor. The X-Y stage has ±500 ?m stroke on both axes and is driven by piezo-stick-slip-actuators. The micro-gripper has two jaws symmetrically driven by one actuator. The maximal opening of the jaws is 1.5 mm and each jaw has a stroke of 300 ?m. The force sensor is composed of four identical parts assembled in a square arrangement, each having a compliant translation mechanism coupled with a capacitive comb that returns an electrical signal corresponding to the force applied on the system. The stroke of the sensor is 200 ?m for a maximal force of 200 mN. The weight and the position of the center of gravity of an object can be measured.
Publication Reference
EUSPEN, Nottingham (UK), pp. 2
Year
2016-01-06
