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dc.contributor.authorGobet, J.
dc.contributor.authorVolpe, P. N.
dc.contributor.authorDubois, M. A.
dc.date.accessioned2021-12-09T13:14:56Z
dc.date.available2021-12-09T13:14:56Z
dc.date.issued2016
dc.identifier.citationApplied Physics Letters, vol. 108 (12), p. 4, Mar 2016.
dc.identifier.urihttps://yoda.csem.ch/handle/20.500.12839/85
dc.description.abstractBecause of its good tribological properties, diamond has been suggested to solve the known reliability issues in silicon MEMS components submitted to frictional contacts. An evaluation of self-mating diamond friction under a low load, representative of a number of MEMS applications, was undertaken. Results have shown that initial friction coefficients of 0.02-0.05 can be achieved, as reported in the literature. However, continuation of the test for an extended period of time invariably led to a strong increase of the friction coefficient. This phenomenon has been observed with different types of diamonds (mono-, micro-, or nano-crystalline), suggesting that it is a general behavior for diamond under our experimental conditions. A micro structuration of the surface prevented this phenomenon by limiting the increase of the contact area resulting from wear. (C) 2016 AIP Publishing LLC.
dc.subjectthin-films, wear, ultrananocrystalline, silicon, coatings, behavior, carbon, mems, Physics
dc.titleFriction coefficient of diamond under conditions compatible with microelectromechanical systems applications
dc.typeJournal Article
dc.type.csemdivisionsDiv-T
dc.type.csemresearchareasOther
dc.identifier.doihttps://doi.org/10.1063/1.4944538


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