Sealing of MEMS Atomic Vapor Cells Using Cu-Cu Thermocompression Bonding

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DOI

10.1109/JMEMS.2019.2949349
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Publication Reference

Journal of Microelectromechanical Systems, vol. 29 (1), pp. 95-99

Year

2020-02

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URI

https://hdl.handle.net/20.500.12839/410

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Research Publications