Sealing of MEMS Atomic Vapor Cells Using Cu-Cu Thermocompression Bonding
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Author
Karlen, Sylvain
Haesler, Jacques
Overstolz, Thomas
Bergonzi, Giovanni
Lecomte, Steve
Abstract
Publication Reference
Journal of Microelectromechanical Systems, vol. 29 (1), pp. 95-99
Year
2020-02