Low temperature covalent wafer bonding for X-ray imaging detectors
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Author
Razek, N.
Neves, J.
Le Corre, P.
Ruedi, P. F.
Quaglia, R.
Dasilva, Y. A. R.
et al.
DOI
https://doi.org/10.7567/1347-4065/ab4970
Abstract
Publication Reference
Japanese Journal of Applied Physics, vol. 59, p. 3, Feb 2020.
Year
2020-01