Bi-parameter thermal-mechanical reliability of miniaturised electromechanical RF relays for space applications

Abstract

Reliability assessment of the miniaturised RF electromechanical relays under the simultaneously applied thermal and mechanical stresses was studied. This combination of stress factors, commonly overseeing by the existing reliability standards and testing procedures, does occur in certain operation conditions, such as during the spacecraft launch phase. It was demonstrated that the relay robustness for the mechanical vibration is not affected by high temperature up to the maximum device operation T of 100 °C. However, a progressive deterioration of the device performance under mechanical shocks with the temperature increase was observed. The relay exhibits state flipping events at lower shock accelerations under high temperatures. The relay's destruction limits are also lower at the maximum device operation temperature. The observed degradation is not large, and the device performance stays within the required specifications even at the highest operation temperature.