High-resolution additive manufacturing for Integrated Q, V, and W-band passive radio frequency hardware
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Author
Guenier, E.
Sinayuc, D.
Unterhofer, S.
Lattion, C.
Mourier, A.
Garcia-Contreras, G.
Garcia-Vigueras, M.
Pejchal, V.
DOI
Abstract
Additive manufacturing (AM) has revolutionized the fabrication of Radio-Frequency (RF) components, overcoming limitations in shape complexity and RF performance. Among AM techniques, Laser Powder Bed Fusion (LPBF) stands out by enabling the production of RF components in a single block, thereby reducing part count and minimizing RF interconnections and waveguide interfaces. LPBF offers high resolution, design freedom, mechanical strength, and surface finish, which can be further enhanced through post-processing. Despite its precision, LPBF still has room for improvement, particularly in RF block performance, which refers to how effectively an RF module or section transmits, guides or manipulates RF signals. In this project, we demonstrated that optimized high-resolution LPBF can achieve surface roughness near 5 µm in as-built conditions for high-conductivity aluminum alloys. We also show significantly improved resolution on critical geometries of RF component structures. This work establishes a new AM end-to-end manufacturing route for Q/V/W-band passive RF hardware using advanced LPBF with Fine Detailed Resolution (FDR).
Publication Reference
CSEM Scientific and Technical Report 2025, p. 57–58
Year
2025