Plenoptic Inspection System for Automatic Quality Control of MEMS and Microsystems

dc.contributor.authorKirschmann, Moritz A.
dc.contributor.authorPierer, Jörg
dc.contributor.authorSteinecker, Alexander
dc.contributor.authorSchmid, Philipp
dc.contributor.authorErdmann, Arne
dc.date.accessioned2022-01-10T12:10:08Z
dc.date.available2022-01-10T12:10:08Z
dc.date.issued2021
dc.description.abstractOptical quality control of MEMS and microsystems is challenging as these structures are micro-scale and three dimensional. Here we lay out different optical systems that can be used for 3D optical quality control in general and for such structures in particular. We further investigate one of these technologies – plenoptic cameras and characterize them for the described task, showing advantages and disadvantages. Key advantages are a huge increase in depth of field compared to conventional microscope camera systems allowing for fast acquisition of non-flat systems and secondly the resulting total focus images and depth maps. Finally we conclude that these advantages render plenoptic cameras a valuable technology for the application of quality control.en_US
dc.identifier.citationS. Ratchev (Ed.): IPAS 2020, IFIP AICT 620, pp. 220–232, 2021en_US
dc.identifier.doihttps://doi.org/10.1007/978-3-030-72632-4_16
dc.identifier.urihttps://hdl.handle.net/20.500.12839/516
dc.language.isoenen_US
dc.subjectQuality Controlen_US
dc.subject3d inspectionen_US
dc.subjectLightfield cameraen_US
dc.titlePlenoptic Inspection System for Automatic Quality Control of MEMS and Microsystemsen_US
dc.typeProceedings Articleen_US
dc.type.csemdivisionsBU-Ren_US
dc.type.csemresearchareasData & AIen_US
dc.type.csemresearchareasIndustry 4.0en_US
dc.type.csemresearchareasMEMS & Packagingen_US
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