Hybrid Integration of Microfabricated Components

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Abstract

CSEM believes that the hybridization of silicon parts with other materials is one of the promising trends for the design of high performance microsystems. In 2012, CSEM has investigated new techniques for both the hybrid integration of silicon at wafer level and at component level.

Publication Reference

CSEM Scientific & Technical Report 2012, p. 15

Year

2012

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https://hdl.handle.net/20.500.12839/1541

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Technical Marketing Material