Hybrid Integration of Microfabricated Components

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dc.contributor.authorBarrot, François
dc.contributor.authorBayat, Dara
dc.contributor.authorCardot, Francis
dc.contributor.authorClerc, P.-A.
dc.contributor.authorFournier, R.
dc.contributor.authorGuillot, L.
dc.contributor.authorJeanneret, S.
dc.contributor.authorKruis, J.
dc.contributor.authorLani, S.
dc.contributor.authorSarajlic, M.
dc.date.accessioned2024-11-20T14:32:06Z
dc.date.available2024-11-20T14:32:06Z
dc.date.issued2012
dc.description.abstractCSEM believes that the hybridization of silicon parts with other materials is one of the promising trends for the design of high performance microsystems. In 2012, CSEM has investigated new techniques for both the hybrid integration of silicon at wafer level and at component level.
dc.identifier.citationCSEM Scientific & Technical Report 2012, p. 15
dc.identifier.urihttps://hdl.handle.net/20.500.12839/1541
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.titleHybrid Integration of Microfabricated Components
dc.typeCSEM Report
dc.type.csemdivisionsBU-T
dc.type.csemresearchareasMEMS & Packaging
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