Thermal Analysis of Parylene Thin Films for Barrier Layer Applications

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dc.contributor.authorBuchwalder, Sébastien
dc.contributor.authorBorzi, Aurelio
dc.contributor.authorDiaz Leon, Juan J
dc.contributor.authorBourgeois, Florian
dc.contributor.authorNicolier, Cléo
dc.contributor.authorNicolay, Sylvain
dc.contributor.authorNeels, Antonia
dc.contributor.authorZywitzki, Olaf
dc.contributor.authorHogg, Andreas
dc.contributor.authorBurger, Juergen
dc.date.accessioned2022-09-05T05:30:05Z
dc.date.available2022-09-05T05:30:05Z
dc.date.issued2022
dc.description.abstractBiocompatible polymer films demonstrating excellent thermal stability are highly desirable for high-temperature (>250 °C) applications, especially in the bioelectronic encapsulation domain. Parylene, as an organic thin film, is a well-established polymer material exhibiting excellent barrier properties and is often the material of choice for biomedical applications. This work investigated the thermal impact on the bulk properties of four types of parylene films: parylene N, C, VT4, and AF4. The films, deposited using the standard Gorham process, were analyzed at varying annealing temperatures from room temperature up to 450 °C. Thermal properties were identified by differential scanning calorimetry (DSC) and thermogravimetric analysis (TGA) methods, while X-ray diffraction (XRD) analysis showed the effect of high-temperature exposure on the structural properties. In addition to thermal and structural analysis, the barrier properties were measured through the helium transmission rate (HTR) and the water vapor transmission rate (WVTR). Fluorinated parylene films were confirmed to be exceptional materials for high-temperature applications. Parylene AF4 film, 25um thick, demonstrated excellent barrier performance after 300 °C exposure, with an HTR and a WVTR of 12.18 × 103 cm3 (STP) m−2 day−1 atm−1 and 6.6 g m−2 day−1, respectively.en_US
dc.description.sponsorshipThis research was funded by Innosuisse, the Swiss Innovation Agency, grant number 41363.1 IP-LS.en_US
dc.identifier.citationBuchwalder, S.; Borzì, A.; Leon, J.J.D.; Bourgeois, F.; Nicolier, C.; Nicolay, S.; Neels, A.; Zywitzki, O.; Hogg, A.; Burger, J. Thermal Analysis of Parylene Thin Films for Barrier Layer Applications. Polymers 2022, 14, 3677. https://doi.org/10.3390/polym14173677en_US
dc.identifier.doi10.3390/polym14173677
dc.identifier.urihttps://hdl.handle.net/20.500.12839/1040
dc.language.isoenen_US
dc.rightsAttribution-NonCommercial-NoDerivatives 4.0 International*
dc.rights.urihttp://creativecommons.org/licenses/by-nc-nd/4.0/*
dc.subjectparyleneen_US
dc.subjectvapor phase depositionen_US
dc.subjectannealingen_US
dc.subjectwater vapor transmission rateen_US
dc.subjectthermal stabilityen_US
dc.subjecthelium transmission rateen_US
dc.titleThermal Analysis of Parylene Thin Films for Barrier Layer Applicationsen_US
dc.typeJournal Articleen_US
dc.type.csemdivisionsBU-Ven_US
dc.type.csemresearchareasOtheren_US
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