A three device silicon based platform for micro-assembly and characterization.

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dc.contributor.authorCosandier, Florent
dc.contributor.authorBarrot, François
dc.contributor.authorKruis, Johan
dc.contributor.authorVoruz, Luc
dc.contributor.authorMusy, Grégory
dc.contributor.authorDroz, Serge
dc.contributor.authorGiriens, Laurent
dc.contributor.authorGlettig, Wayne
dc.contributor.authorDominé, Emmanuel
dc.date.accessioned2022-02-14T17:08:00Z
dc.date.available2022-02-14T17:08:00Z
dc.date.issued2016-01-06
dc.description.abstractIn order to improve the assembly process of microcomponents, three high precision mechanisms were developed. All of them were designed and fabricated at CSEM, through a silicon etching process (DRIE). The devices are an X-Y stage, a micro-gripper and a force sensor. The X-Y stage has ±500 ?m stroke on both axes and is driven by piezo-stick-slip-actuators. The micro-gripper has two jaws symmetrically driven by one actuator. The maximal opening of the jaws is 1.5 mm and each jaw has a stroke of 300 ?m. The force sensor is composed of four identical parts assembled in a square arrangement, each having a compliant translation mechanism coupled with a capacitive comb that returns an electrical signal corresponding to the force applied on the system. The stroke of the sensor is 200 ?m for a maximal force of 200 mN. The weight and the position of the center of gravity of an object can be measured.
dc.identifier.citationEUSPEN, Nottingham (UK), pp. 2
dc.identifier.urihttps://hdl.handle.net/20.500.12839/834
dc.titleA three device silicon based platform for micro-assembly and characterization.
dc.typeProceedings Article
dc.type.csemdivisionsBU-I
dc.type.csemresearchareasScientific Instrumentation
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