Scalable and versatile chip to fiber optical interconnects
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Author
Basset, Guillaume
Krähenbühl, Roger
Renggli, Martina
Mohrdiek, Stephan
DOI
10.1117/12.3003107
Abstract
Plug and play fiber coupling at the wafer-scale is highly relevant to interconnect photonic integrated circuits (PICs), switches and multiplexer for short to long range communication, as well as chiplets in new chip design with optical interconnects. A new solution is presented being compact, low-loss, and in plane, adaptable to a wide range of fibers. It is based on beam-shaping reflecting elements monolithically fabricated with integrated comp like fiber alignment structures. Successful assembly of a 12-fiber ribbon is demonstrated with excess losses as low as 0.35 dB. The processes and methods are highly homogeneous and scalable.
Publication Reference
Proc. SPIE PC12892, Optical Interconnects XXIV, PC1289206 (12 March 2024)
Year
2024-01-29