MEMS atomic vapor cells sealed by Cu-Cu thermocompression bonding
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Author
Karlen, Sylvain
Haesler, Jacques
Overstolz, Thomas
Bergonzi, Giovanni
Lecomte, Steve
DOI
10.1109/FCS.2017.8088979
Abstract
Publication Reference
2017 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFC), Besançon (France), pp. 625-627
Year
2017