MEMS atomic vapor cells sealed by Cu-Cu thermocompression bonding
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Author
Karlen, Sylvain
Haesler, Jacques
Overstolz, Thomas
Bergonzi, Giovanni
Lecomte, Steve
Abstract
Publication Reference
2017 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFC), Besançon (France), pp. 625-627
Year
2017